CLOTH-LIKE LAMINATED CIRCUIT STRUCTURE BODY
To provide a cloth-like laminated circuit structure body which has the elasticity and flexibility for stabilizing and holding the electric conductivity of wiring and has excellent air permeability.SOLUTION: A cloth-like laminated circuit structure body 1 comprises: a base part 10 which is made of an...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a cloth-like laminated circuit structure body which has the elasticity and flexibility for stabilizing and holding the electric conductivity of wiring and has excellent air permeability.SOLUTION: A cloth-like laminated circuit structure body 1 comprises: a base part 10 which is made of an insulation textile; wiring parts 20-23 which are made of conductive textures to which adhesive resin materials discretely adhere and which are laminated and bonded on both surfaces of the base part; connection parts 30, 31 to which the conductive textures are electrically connected through connection holes formed on the insulation textile; and circuit parts 40-43 which are connected to the wiring parts.SELECTED DRAWING: Figure 1
【課題】配線の導通性を安定し保持する伸縮性及び屈曲性を備えるとともに優れた通気性を有する布帛状積層回路構造体を提供する。【解決手段】布帛状積層回路構造体1は、絶縁性布地からなる基体部10と、接着性樹脂材料が離散的に付着している導電性布地からなるとともに基体部の両面に積層して接着された配線部20〜23と、絶縁性布地に形成された接続孔を通して導電性布地が電気的に接続された接続部30、31と、配線部に接続された回路部40〜43とを備える。【選択図】図1 |
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