COOLING STRUCTURE

To ensure a tightening margin at low resilience, while at the same time improving a heat transfer performance.SOLUTION: A cooling structure 93 has: a heating part 20; a heat radiation part 40 which is at a lower temperature than that of the heating part 20; and heat transfer bodies 30 which are inte...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HANDA YUICHI, KOKETSU KAORU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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