COOLING STRUCTURE

To ensure a tightening margin at low resilience, while at the same time improving a heat transfer performance.SOLUTION: A cooling structure 93 has: a heating part 20; a heat radiation part 40 which is at a lower temperature than that of the heating part 20; and heat transfer bodies 30 which are inte...

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Bibliographische Detailangaben
Hauptverfasser: HANDA YUICHI, KOKETSU KAORU
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To ensure a tightening margin at low resilience, while at the same time improving a heat transfer performance.SOLUTION: A cooling structure 93 has: a heating part 20; a heat radiation part 40 which is at a lower temperature than that of the heating part 20; and heat transfer bodies 30 which are interposed in a gap "g" between the heating part 20 and the heat radiation part 40. Each of the heat transfer bodies 30 is provided with a plurality of fins 36 which is aligned in an alignment direction Y. Between the heating part 20 and the heat radiation part 40, the plurality of heat transfer bodies 30 is interposed in an overlapping manner. Thus, viewing in a direction X perpendicular to the alignment direction Y, the fins 36 of one of the heat transfer bodies 30 are disposed between the fins 36 of another one of the heat transfer bodies 30. The heat of the heating part 20 is transferred to the heat radiation part 40 by each of the fins 36 of each of the heat transfer bodies 30.SELECTED DRAWING: Figure 2 【課題】低反発での締め代の確保と伝熱性能の向上との両立を可能にする。【解決手段】冷却構造93は、発熱部20と、発熱部20よりも低温になる放熱部40と、発熱部20と放熱部40との間隔gに介装されている伝熱体30とを有する。そして、伝熱体30には、複数のフィン36が並設方向Yに並設されている。発熱部20と放熱部40との間には、複数の伝熱体30が、互いに重なり合った状態で介装されている。それにより、並設方向Yに直交する方向Xに見て、一の伝熱体30のフィン36どうしの間に、他の伝熱体30のフィン36が配置されている。そして、各伝熱体30の各フィン36により発熱部20の熱を放熱部40に伝える。【選択図】図2