FIBER REINFORCED MOLDED ARTICLE AND HOUSING FOR ELECTRONIC DEVICE

To provide a fiber reinforced molded article having a conductivity in a thickness direction without having any projection on a surface such as a bolt for ensuring conductivity.SOLUTION: A fiber reinforced molded article 10 comprises carbon fiber reinforced layers 21 and 21 which are integrally laminated on both sides of a resin layer 11 consisting of a foam body impregnated with a thermosetting resin and cured in a compressed state, in which a metal block 31 is embedded and penetrates through the resin layer 11 in the thickness direction, and the metal block 31 embedded in the resin layer 11 is in contact with the carbon fiber reinforced layers 21 and 21 on both sides of the resin layer 11, and a good conductivity between the carbon fiber reinforced layers 21 and 21 on both sides of the resin layer 11 is ensured by the metal block 31 embedded in the resin layer 11.SELECTED DRAWING: Figure 2 【課題】厚み方向に導電性を有し、導電性確保のためのボルトなどによる突部が表面に存在しない繊維強化成形体の提供を目的とする。【解決手段】熱硬化性樹脂が含浸した発泡体が圧縮された状態で硬化してなる樹脂層１１の両面に、炭素繊維強化層２１、２１を積層一体化した繊維強化成形体１０において、樹脂層１１には厚み方向に金属塊３１が貫通して埋設され、樹脂層１１に埋設された金属塊３１が樹脂層１１の両面で炭素繊維強化層２１、２１と接触した構成からなり、樹脂層１１に埋設した金属塊３１によって樹脂層１１の両面の炭素繊維強化層２１、２１間の良好な導電性を確保した。【選択図】図２