COVER TAPE FOR PACKING ELECTRONIC COMPONENT AND PACKAGE

To provide a cover tape for packing an electronic component with improved visibility of the electronic component.SOLUTION: A cover tape for packing an electronic component includes a base layer 2, a heat seal layer 3 disposed on one surface of the base layer 2, and an intermediate layer 4 disposed b...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE MASAKUNI, NAGATSUKA YASUNORI, YANAGISAWA SHUNPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DYES HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PACKAGES PACKAGING ELEMENTS PACKING PAINTS PERFORMING OPERATIONS POLISHES STORING TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a cover tape for packing an electronic component with improved visibility of the electronic component.SOLUTION: A cover tape for packing an electronic component includes a base layer 2, a heat seal layer 3 disposed on one surface of the base layer 2, and an intermediate layer 4 disposed between the base layer 2 and the heat seal layer 3. An average length (Rsm) of roughness curved line elements on a surface of a side of the heat seal layer of the cover tape for packing the electronic component is 200 μm or less.SELECTED DRAWING: Figure 1 【課題】電子部品の視認性が向上した電子部品包装用カバーテープを提供する。【解決手段】基材層２と、前記基材層２の一方の面側に配置されたヒートシール層３と、前記基材層２と前記ヒートシール層３との間に配置された中間層４と、を有する電子部品包装用カバーテープであって、電子部品包装用カバーテープの前記ヒートシール層側の表面の粗さ曲線要素の平均長さ（Ｒｓｍ）が２００μｍ以下であることを特徴とする。【選択図】図１