CARRIER FOR BONDING, METHOD FOR PREPARING BONDED BODY, AND BONDING METHOD

To provide a bonding technique that facilitates the application of a thick coat.SOLUTION: The inventive method for preparing a bonded body has a reductant impregnation step and an adhesive impregnation step, and a carrier disposing step. In the reductant impregnation step, the carrier having a plura...

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Bibliographische Detailangaben
Hauptverfasser:	KONNO MAKOTO, SAITO KEISUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a bonding technique that facilitates the application of a thick coat.SOLUTION: The inventive method for preparing a bonded body has a reductant impregnation step and an adhesive impregnation step, and a carrier disposing step. In the reductant impregnation step, the carrier having a plurality of voids inside is impregnated with a reductant. In the adhesive impregnation step, the carrier comprising the reductant is impregnated with an acrylic adhesive. In the carrier disposing step, the carrier comprising the reductant and acrylic adhesive is disposed between a first adherend and a second adherend. The reaction between the acrylic adhesive and reductant bonds the first and second adherends together.SELECTED DRAWING: Figure 5 【課題】本願発明の課題は、従来技術が抱える問題を解決することであり、すなわち厚膜塗布を容易に行うことができる接着技術を提供することである。【解決手段】本願発明の接着体製造方法は、還元剤含浸工程と接着剤含浸工程、担持体配置工程を備えた方法である。このうち還元剤含浸工程では、内部に複数の空隙を有する担持体に還元剤を含浸させ、接着剤含浸工程では、還元剤を含んだ担持体にアクリル系接着剤を含浸させる。また担持体配置工程では、還元剤とアクリル系接着剤を含んだ担持体を、第１被着体と第２被着体の間に配置する。そして、アクリル系接着剤と還元剤が反応することによって、第１被着体と第２被着体が接着される。【選択図】図５