SURFACE PROCESSING DEVICE AND SURFACE PROCESSING METHOD
To provide a surface processing device whose cost can be suppressed while improving processing efficiency and a surface processing method.SOLUTION: A surface processing device 1 according to the present invention comprises: a beam irradiation unit 3 that irradiates some range on a surface of a work-...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NAGAHAMA TAKAYA MIZOGUCHI TAKASHI |
| description | To provide a surface processing device whose cost can be suppressed while improving processing efficiency and a surface processing method.SOLUTION: A surface processing device 1 according to the present invention comprises: a beam irradiation unit 3 that irradiates some range on a surface of a work-piece W with a beam so as to form a fragile part which is lower in toughness than a base material of the work-piece W, and leaves a non-fragile part as the base material of the work-piece in a range not irradiated with the beam on the surface of the work-piece W; and a grinding unit 4 that grinds and removes the fragile part while leaving at least a portion of the non-fragile part on the surface of the work-piece W so as to form a functional surface having uneven shapes on the surface of the work-piece W.SELECTED DRAWING: Figure 3
【課題】加工能率を向上させつつ、装置コストを抑えることができる表面加工装置及び表面加工方法を提供する。【解決手段】本発明に係る表面加工装置１は、工作物Ｗの表面の一部範囲にビームを照射することにより工作物Ｗの基材よりも靭性の低い脆化部を形成し、工作物Ｗの表面においてビームが照射されていない範囲に工作物の基材としての非脆化部を残した状態とするビーム照射ユニット３と、工作物Ｗの表面において非脆化部の少なくとも一部を残して脆化部を研削除去することにより、工作物Ｗの表面に凹凸形状を有する機能性表面を形成する研削ユニット４とを備える。【選択図】図３ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021171811A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021171811A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021171811A3</originalsourceid><addsrcrecordid>eNrjZDAPDg1yc3R2VQgI8nd2DQ729HNXcHEN8wSKOPq5KGCR9XUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGhobmhhaGho7GRCkCAIpQKJI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE PROCESSING DEVICE AND SURFACE PROCESSING METHOD</title><source>esp@cenet</source><creator>NAGAHAMA TAKAYA ; MIZOGUCHI TAKASHI</creator><creatorcontrib>NAGAHAMA TAKAYA ; MIZOGUCHI TAKASHI</creatorcontrib><description>To provide a surface processing device whose cost can be suppressed while improving processing efficiency and a surface processing method.SOLUTION: A surface processing device 1 according to the present invention comprises: a beam irradiation unit 3 that irradiates some range on a surface of a work-piece W with a beam so as to form a fragile part which is lower in toughness than a base material of the work-piece W, and leaves a non-fragile part as the base material of the work-piece in a range not irradiated with the beam on the surface of the work-piece W; and a grinding unit 4 that grinds and removes the fragile part while leaving at least a portion of the non-fragile part on the surface of the work-piece W so as to form a functional surface having uneven shapes on the surface of the work-piece W.SELECTED DRAWING: Figure 3
【課題】加工能率を向上させつつ、装置コストを抑えることができる表面加工装置及び表面加工方法を提供する。【解決手段】本発明に係る表面加工装置１は、工作物Ｗの表面の一部範囲にビームを照射することにより工作物Ｗの基材よりも靭性の低い脆化部を形成し、工作物Ｗの表面においてビームが照射されていない範囲に工作物の基材としての非脆化部を残した状態とするビーム照射ユニット３と、工作物Ｗの表面において非脆化部の少なくとも一部を残して脆化部を研削除去することにより、工作物Ｗの表面に凹凸形状を有する機能性表面を形成する研削ユニット４とを備える。【選択図】図３</description><language>eng ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211101&DB=EPODOC&CC=JP&NR=2021171811A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211101&DB=EPODOC&CC=JP&NR=2021171811A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAHAMA TAKAYA</creatorcontrib><creatorcontrib>MIZOGUCHI TAKASHI</creatorcontrib><title>SURFACE PROCESSING DEVICE AND SURFACE PROCESSING METHOD</title><description>To provide a surface processing device whose cost can be suppressed while improving processing efficiency and a surface processing method.SOLUTION: A surface processing device 1 according to the present invention comprises: a beam irradiation unit 3 that irradiates some range on a surface of a work-piece W with a beam so as to form a fragile part which is lower in toughness than a base material of the work-piece W, and leaves a non-fragile part as the base material of the work-piece in a range not irradiated with the beam on the surface of the work-piece W; and a grinding unit 4 that grinds and removes the fragile part while leaving at least a portion of the non-fragile part on the surface of the work-piece W so as to form a functional surface having uneven shapes on the surface of the work-piece W.SELECTED DRAWING: Figure 3
【課題】加工能率を向上させつつ、装置コストを抑えることができる表面加工装置及び表面加工方法を提供する。【解決手段】本発明に係る表面加工装置１は、工作物Ｗの表面の一部範囲にビームを照射することにより工作物Ｗの基材よりも靭性の低い脆化部を形成し、工作物Ｗの表面においてビームが照射されていない範囲に工作物の基材としての非脆化部を残した状態とするビーム照射ユニット３と、工作物Ｗの表面において非脆化部の少なくとも一部を残して脆化部を研削除去することにより、工作物Ｗの表面に凹凸形状を有する機能性表面を形成する研削ユニット４とを備える。【選択図】図３</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPDg1yc3R2VQgI8nd2DQ729HNXcHEN8wSKOPq5KGCR9XUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGhobmhhaGho7GRCkCAIpQKJI</recordid><startdate>20211101</startdate><enddate>20211101</enddate><creator>NAGAHAMA TAKAYA</creator><creator>MIZOGUCHI TAKASHI</creator><scope>EVB</scope></search><sort><creationdate>20211101</creationdate><title>SURFACE PROCESSING DEVICE AND SURFACE PROCESSING METHOD</title><author>NAGAHAMA TAKAYA ; MIZOGUCHI TAKASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021171811A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAHAMA TAKAYA</creatorcontrib><creatorcontrib>MIZOGUCHI TAKASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAHAMA TAKAYA</au><au>MIZOGUCHI TAKASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE PROCESSING DEVICE AND SURFACE PROCESSING METHOD</title><date>2021-11-01</date><risdate>2021</risdate><abstract>To provide a surface processing device whose cost can be suppressed while improving processing efficiency and a surface processing method.SOLUTION: A surface processing device 1 according to the present invention comprises: a beam irradiation unit 3 that irradiates some range on a surface of a work-piece W with a beam so as to form a fragile part which is lower in toughness than a base material of the work-piece W, and leaves a non-fragile part as the base material of the work-piece in a range not irradiated with the beam on the surface of the work-piece W; and a grinding unit 4 that grinds and removes the fragile part while leaving at least a portion of the non-fragile part on the surface of the work-piece W so as to form a functional surface having uneven shapes on the surface of the work-piece W.SELECTED DRAWING: Figure 3
【課題】加工能率を向上させつつ、装置コストを抑えることができる表面加工装置及び表面加工方法を提供する。【解決手段】本発明に係る表面加工装置１は、工作物Ｗの表面の一部範囲にビームを照射することにより工作物Ｗの基材よりも靭性の低い脆化部を形成し、工作物Ｗの表面においてビームが照射されていない範囲に工作物の基材としての非脆化部を残した状態とするビーム照射ユニット３と、工作物Ｗの表面において非脆化部の少なくとも一部を残して脆化部を研削除去することにより、工作物Ｗの表面に凹凸形状を有する機能性表面を形成する研削ユニット４とを備える。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2021171811A |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SURFACE PROCESSING DEVICE AND SURFACE PROCESSING METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T09%3A33%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAGAHAMA%20TAKAYA&rft.date=2021-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2021171811A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |