SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To provide a technology capable of suppressing insulation failure caused by an air bubble inherent in an adhesive reaching a circuit pattern in a semiconductor device.SOLUTION: A semiconductor device 100 includes a resin insulated copper base plate 1 having a copper base plate 1a, an insulation laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SAKUMOTO SHOTARO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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