RESIN COMPOSITION AND MOLDING THEREOF

To provide: a resin composition which can provide a molding which shows little deformation, has excellent toughness and, even when it comes in contact with an article having a plating layer on its surface, causes little separation of the plating of the counterpart article; and a molding thereof.SOLU...

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Bibliographische Detailangaben
1. Verfasser:	OSANAGA AKIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CURRENT COLLECTORS ELECTRICITY LINE CONNECTORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide: a resin composition which can provide a molding which shows little deformation, has excellent toughness and, even when it comes in contact with an article having a plating layer on its surface, causes little separation of the plating of the counterpart article; and a molding thereof.SOLUTION: A resin composition comprises 55 to 80 mass% of all aromatic polyester amide having the following constituent units (I) to (V) and 20 to 45 mass% of whiskers.SELECTED DRAWING: Figure 1 【課題】変形が少なく、靭性に優れ、表面にめっき層を有する物品と接触しても相手物品のめっき剥がれが少ない成形品を与えることができる樹脂組成物、及びその成形品を提供する。【解決手段】下記構成単位（Ｉ）〜（Ｖ）を有する全芳香族ポリエステルアミド５５〜８０質量％、ウィスカー２０〜４５質量％からなる樹脂組成物。【選択図】図１