SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
To provide a semiconductor device capable of suppressing degradation of an electro-static discharge (ESD) protection element, easily achieving a desired withstanding voltage and giving a sufficient ESD resistance, and to provide a method of manufacturing the same.SOLUTION: In a semiconductor device,...
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Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a semiconductor device capable of suppressing degradation of an electro-static discharge (ESD) protection element, easily achieving a desired withstanding voltage and giving a sufficient ESD resistance, and to provide a method of manufacturing the same.SOLUTION: In a semiconductor device, a high-concentration diffusion layer 103 and a low-concentration diffusion layer 102 are arranged around a drain diffusion layer 106B of an ESD protection element. The high-concentration diffusion layer 103 is separated from a gate electrode 105, and an intermediate-concentration LDD diffusion layer 107B is arranged in a gap between the high-concentration diffusion layer 103 and the gate electrode 105. Heat treatment to the high-concentration diffusion layer 103 and the intermediate-concentration diffusion layer 107B is shortened to suppress variation in characteristics.SELECTED DRAWING: Figure 1
【課題】ESD保護素子の劣化を抑制し、所望の耐圧を容易に実現するとともに十分なESD耐性を有する半導体装置およびその製造方法を提供する。【解決手段】半導体装置において、ESD保護素子のドレイン拡散層106Bの周りに高濃度拡散層103と低濃度拡散層102を配置する。高濃度拡散層103はゲート電極105から離間し、離間した隙間に中濃度のLDD拡散層107Bを配置する。高濃度拡散層103および中濃度拡散層107に対する熱処理を少なくすることで特性のばらつきを抑制する。【選択図】 図1 |
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