WAFER THROUGH HOLE PRINTING METAL MASK
To provide a wafer through hole printing metal mask capable of reducing the damage of a squeegee and preventing the periphery of an opening of the metal mask from rolling up.SOLUTION: A wafer through hole printing metal mask for printing a conductive paste 6 in a through hole of a wafer 1 includes:...
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| creator | MOGI TAKASHI |
| description | To provide a wafer through hole printing metal mask capable of reducing the damage of a squeegee and preventing the periphery of an opening of the metal mask from rolling up.SOLUTION: A wafer through hole printing metal mask for printing a conductive paste 6 in a through hole of a wafer 1 includes: a wafer through hole printing metal mask formed in a square frame shape; and a circular opening 3 formed in a central part of the wafer through hole printing metal mask and having a size slightly smaller than a size of the wafer and having a size including all through holes formed in the wafer in the inside. A peripheral upper surface of the circular opening is formed in an R shape 8 having a roundness descending downward toward the inside from the outside or a tapered shape, and a recessed part (a step) 8 is formed toward the outside from a position right under a region used as an origin in the R shape having a roundness on the peripheral upper surface of the circular opening or the tapered shape on a lower surface side of the wafer through hole printing metal mask.SELECTED DRAWING: Figure 3
【課題】スキージのダメージを軽減し、メタルマスクの開口部周縁の捲り上がりを防止できるウエハースルーホール印刷用メタルマスクを得る。【解決手段】ウエハー１のスルーホールに導電性ペースト６を印刷するためのものであって、四角枠状に形成されたウエハースルーホール印刷用メタルマスクと、ウエハースルーホール印刷用メタルマスクの中央部に形成され、ウエハーサイズよりも若干小さくウエハーに形成されたスルーホールの全てをその内側に包含する大きさを有する円形状開口部３と、を備え、円形状開口部の周縁上面を、外側から内側に向かって下向きに下がる丸みを持ったＲ形状８又はテーパー形状に形成し、ウエハースルーホール印刷用メタルマスクの下面側であって、円形状開口部の周縁上面の丸みを持ったＲ形状又はテーパー形状の起点となる部位の直下位置から外側に向かって凹部（段差）８を形成する。【選択図】図３ |
| format | Patent |
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【課題】スキージのダメージを軽減し、メタルマスクの開口部周縁の捲り上がりを防止できるウエハースルーホール印刷用メタルマスクを得る。【解決手段】ウエハー１のスルーホールに導電性ペースト６を印刷するためのものであって、四角枠状に形成されたウエハースルーホール印刷用メタルマスクと、ウエハースルーホール印刷用メタルマスクの中央部に形成され、ウエハーサイズよりも若干小さくウエハーに形成されたスルーホールの全てをその内側に包含する大きさを有する円形状開口部３と、を備え、円形状開口部の周縁上面を、外側から内側に向かって下向きに下がる丸みを持ったＲ形状８又はテーパー形状に形成し、ウエハースルーホール印刷用メタルマスクの下面側であって、円形状開口部の周縁上面の丸みを持ったＲ形状又はテーパー形状の起点となる部位の直下位置から外側に向かって凹部（段差）８を形成する。【選択図】図３</description><language>eng ; jpn</language><subject>LINING MACHINES ; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE ; PERFORMING OPERATIONS ; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM ; PRINTING ; PRINTING PLATES OR FOILS ; PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211011&DB=EPODOC&CC=JP&NR=2021160088A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211011&DB=EPODOC&CC=JP&NR=2021160088A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MOGI TAKASHI</creatorcontrib><title>WAFER THROUGH HOLE PRINTING METAL MASK</title><description>To provide a wafer through hole printing metal mask capable of reducing the damage of a squeegee and preventing the periphery of an opening of the metal mask from rolling up.SOLUTION: A wafer through hole printing metal mask for printing a conductive paste 6 in a through hole of a wafer 1 includes: a wafer through hole printing metal mask formed in a square frame shape; and a circular opening 3 formed in a central part of the wafer through hole printing metal mask and having a size slightly smaller than a size of the wafer and having a size including all through holes formed in the wafer in the inside. A peripheral upper surface of the circular opening is formed in an R shape 8 having a roundness descending downward toward the inside from the outside or a tapered shape, and a recessed part (a step) 8 is formed toward the outside from a position right under a region used as an origin in the R shape having a roundness on the peripheral upper surface of the circular opening or the tapered shape on a lower surface side of the wafer through hole printing metal mask.SELECTED DRAWING: Figure 3
【課題】スキージのダメージを軽減し、メタルマスクの開口部周縁の捲り上がりを防止できるウエハースルーホール印刷用メタルマスクを得る。【解決手段】ウエハー１のスルーホールに導電性ペースト６を印刷するためのものであって、四角枠状に形成されたウエハースルーホール印刷用メタルマスクと、ウエハースルーホール印刷用メタルマスクの中央部に形成され、ウエハーサイズよりも若干小さくウエハーに形成されたスルーホールの全てをその内側に包含する大きさを有する円形状開口部３と、を備え、円形状開口部の周縁上面を、外側から内側に向かって下向きに下がる丸みを持ったＲ形状８又はテーパー形状に形成し、ウエハースルーホール印刷用メタルマスクの下面側であって、円形状開口部の周縁上面の丸みを持ったＲ形状又はテーパー形状の起点となる部位の直下位置から外側に向かって凹部（段差）８を形成する。【選択図】図３</description><subject>LINING MACHINES</subject><subject>MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE</subject><subject>PERFORMING OPERATIONS</subject><subject>PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM</subject><subject>PRINTING</subject><subject>PRINTING PLATES OR FOILS</subject><subject>PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFALd3RzDVII8QjyD3X3UPDw93FVCAjy9Avx9HNX8HUNcfRR8HUM9uZhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoaGZgYGFhaOxkQpAgAAhiPh</recordid><startdate>20211011</startdate><enddate>20211011</enddate><creator>MOGI TAKASHI</creator><scope>EVB</scope></search><sort><creationdate>20211011</creationdate><title>WAFER THROUGH HOLE PRINTING METAL MASK</title><author>MOGI TAKASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021160088A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>LINING MACHINES</topic><topic>MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE</topic><topic>PERFORMING OPERATIONS</topic><topic>PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM</topic><topic>PRINTING</topic><topic>PRINTING PLATES OR FOILS</topic><topic>PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>MOGI TAKASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOGI TAKASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER THROUGH HOLE PRINTING METAL MASK</title><date>2021-10-11</date><risdate>2021</risdate><abstract>To provide a wafer through hole printing metal mask capable of reducing the damage of a squeegee and preventing the periphery of an opening of the metal mask from rolling up.SOLUTION: A wafer through hole printing metal mask for printing a conductive paste 6 in a through hole of a wafer 1 includes: a wafer through hole printing metal mask formed in a square frame shape; and a circular opening 3 formed in a central part of the wafer through hole printing metal mask and having a size slightly smaller than a size of the wafer and having a size including all through holes formed in the wafer in the inside. A peripheral upper surface of the circular opening is formed in an R shape 8 having a roundness descending downward toward the inside from the outside or a tapered shape, and a recessed part (a step) 8 is formed toward the outside from a position right under a region used as an origin in the R shape having a roundness on the peripheral upper surface of the circular opening or the tapered shape on a lower surface side of the wafer through hole printing metal mask.SELECTED DRAWING: Figure 3
【課題】スキージのダメージを軽減し、メタルマスクの開口部周縁の捲り上がりを防止できるウエハースルーホール印刷用メタルマスクを得る。【解決手段】ウエハー１のスルーホールに導電性ペースト６を印刷するためのものであって、四角枠状に形成されたウエハースルーホール印刷用メタルマスクと、ウエハースルーホール印刷用メタルマスクの中央部に形成され、ウエハーサイズよりも若干小さくウエハーに形成されたスルーホールの全てをその内側に包含する大きさを有する円形状開口部３と、を備え、円形状開口部の周縁上面を、外側から内側に向かって下向きに下がる丸みを持ったＲ形状８又はテーパー形状に形成し、ウエハースルーホール印刷用メタルマスクの下面側であって、円形状開口部の周縁上面の丸みを持ったＲ形状又はテーパー形状の起点となる部位の直下位置から外側に向かって凹部（段差）８を形成する。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | LINING MACHINES MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE PERFORMING OPERATIONS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTING PRINTING PLATES OR FOILS PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES STAMPS TRANSPORTING TYPEWRITERS |
| title | WAFER THROUGH HOLE PRINTING METAL MASK |
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