PIEZOELECTRIC OSCILLATOR

To improve the reliability of the connection of integrated circuit elements in a piezoelectric oscillator.SOLUTION: A piezoelectric oscillator includes an insulating substrate with better flatness than ceramic and on which a wiring pattern is formed, a piezoelectric transducer, an integrated circuit...

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Bibliographische Detailangaben
1. Verfasser:	MORIWAKI TORU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
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Beschreibung
Zusammenfassung:	To improve the reliability of the connection of integrated circuit elements in a piezoelectric oscillator.SOLUTION: A piezoelectric oscillator includes an insulating substrate with better flatness than ceramic and on which a wiring pattern is formed, a piezoelectric transducer, an integrated circuit element mounted on the insulating substrate, a heating element that heats the piezoelectric transducer, and a container that contains and hermetically seals the insulating substrate on which the integrated circuit element is mounted. The integrated circuit element has a plurality of electrode pads. The electrode pads are flip-chip connected to the wiring pattern of the insulating substrate via bumps.SELECTED DRAWING: Figure 1 【課題】圧電発振器において、集積回路素子の接続の信頼性を向上させる。【解決手段】セラミックに比べて平坦度が良好であって、かつ、配線パターンが形成された絶縁性の基板と、圧電振動子と、前記絶縁性の基板に搭載された集積回路素子と、前記圧電振動子を加熱する発熱体と、前記集積回路素子が搭載された前記絶縁性の基板を収容して気密封止する容器とを備え、前記集積回路素子は、複数の電極パッドを有すると共に、前記電極パッドがバンプを介して前記絶縁性の基板の前記配線パターンにフリップチップ接続される。【選択図】図１