CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide: a curable resin composition which exhibits excellent developing performance and can form a cured product having excellent chemical resistance; a dry film having a resin layer obtained from the composition; a cured product of the composition or of the resin layer of the dry film; and an e...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBATA DAISUKE, FUNAKOSHI CHIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide: a curable resin composition which exhibits excellent developing performance and can form a cured product having excellent chemical resistance; a dry film having a resin layer obtained from the composition; a cured product of the composition or of the resin layer of the dry film; and an electronic component having the cured product.SOLUTION: A curable resin composition and the like comprise a carboxyl group-containing resin (A), a photopolymerization initiator (B), an epoxy resin (C), and a silica (D), wherein: the curable resin composition does not comprise a silica having a particle size of more than 300 nm as the silica; and a ratio of (an epoxy group in the epoxy resin (C))/(a carboxyl group in the carboxyl group-containing resin (A)) is 1.9-2.9.SELECTED DRAWING: None 【課題】解像性に優れ、かつ、薬品耐性に優れた硬化物を形成可能な感光性の硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、該組成物または該ドライフィルムの樹脂層の硬化物、および、該硬化物を有する電子部品を提供する。【解決手段】（Ａ）カルボキシル基含有樹脂と、（Ｂ）光重合開始剤と、（Ｃ）エポキシ樹脂と、（Ｄ）シリカとを含有する硬化性樹脂組成物であって、前記（Ｄ）シリカとして、粒子径が３００ｎｍ超のシリカを含有せず、前記（Ｃ）エポキシ樹脂のエポキシ基／前記（Ａ）カルボキシル基含有樹脂のカルボキシル基の比が、１．９〜２．９であることを特徴とする硬化性樹脂組成物等である。【選択図】なし