RESIN COMPOSITION

To provide a resin composition with excellent thermal conductivity and extension.SOLUTION: A resin composition contains ethylene-(meth)acrylate copolymers, first inorganic particles, and second inorganic particles having an average particle diameter 5 times or more and 10 times or less the first ino...

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Bibliographische Detailangaben
Hauptverfasser:	YOKOUCHI NAOKI, SANADA KAZUAKI, UCHIDA YOHEI, NAGATA KAZUYA, NISHIAKI YASUHIRO, NISHIYAMA YUGO, HORIBE TAKAYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a resin composition with excellent thermal conductivity and extension.SOLUTION: A resin composition contains ethylene-(meth)acrylate copolymers, first inorganic particles, and second inorganic particles having an average particle diameter 5 times or more and 10 times or less the first inorganic particles. The total content of the first inorganic particles and the second inorganic particles for the total of the ethylene-(meth)acrylate copolymers, the first inorganic particles and the second inorganic particles is 15 vol.% or more and 25 vol.% or less. The content of the first inorganic particles for the total of the first inorganic particles and the second inorganic particles is 20 vol.% or more and 60 vol.% or less.SELECTED DRAWING: Figure 1 【課題】熱伝導性及び伸びが良好な樹脂組成物を提供する。【解決手段】樹脂組成物は、エチレン−（メタ）アクリレート共重合体と、第１無機粒子と、第１無機粒子に対して５倍以上１０倍以下の平均粒子径を有する第２無機粒子と、を含有する。エチレン−（メタ）アクリレート共重合体、第１無機粒子及び第２無機粒子の合計に対する第１無機粒子及び第２無機粒子の合計含有量は１５体積％以上２５体積％以下である。第１無機粒子及び第２無機粒子の合計に対する第１無機粒子の含有量は２０体積％以上６０体積％以下である。【選択図】図１