SOLDER COMPOSITION FOR LASER SOLDERING, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE

To provide a solder composition for laser soldering which can sufficiently suppress generation of a solder ball in laser soldering.SOLUTION: A solder composition for laser soldering contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent and (D) a thixotropic...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUNO TAKEMI, YOSHIZAWA SHINJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a solder composition for laser soldering which can sufficiently suppress generation of a solder ball in laser soldering.SOLUTION: A solder composition for laser soldering contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent and (D) a thixotropic agent, and (E) solder powder, in which the component (A) contains (A1) polymerized rosin having a softening point of 130°C or higher and an acid value of 200 mgKOH/g or less, and the component (C) contains (C1) dialkyl sebacate.SELECTED DRAWING: None 【課題】レーザーはんだ付けをする場合に、はんだボールの発生を十分に抑制できるレーザーはんだ付け用はんだ組成物を提供すること。【解決手段】本発明のレーザーはんだ付け用はんだ組成物は、（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）溶剤および（Ｄ）チクソ剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、前記（Ａ）成分が、（Ａ１）軟化点が１３０℃以上であり、かつ酸価が２００ｍｇＫＯＨ／ｇ以下である重合ロジンを含有し、前記（Ｃ）成分が、（Ｃ１）セバシン酸ジアルキルを含有することを特徴とするものである。【選択図】なし