MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF

To provide a multilayer ceramic electronic component and a mounting board thereof.SOLUTION: The present invention provides a multilayer ceramic electronic component including: a ceramic body including a plurality of dielectric layers: an active part including a plurality of first and second internal...

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Hauptverfasser: LEE JONG HO, CHAE EUN HYUK, GU HYUN HEE, CHOI JAE YEOL
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a multilayer ceramic electronic component and a mounting board thereof.SOLUTION: The present invention provides a multilayer ceramic electronic component including: a ceramic body including a plurality of dielectric layers: an active part including a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to respective end surfaces of the ceramic body, with each dielectric layer interposed therebetween; an upper cover part formed above the active part; a lower cover part formed below the active part and having a thickness greater than that of the upper cover part; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The first and second external electrodes include first and second electrode layers, respectively. The first and second electrode layers are disposed on both side surfaces forming both end surfaces of the ceramic body in a length direction, respectively, and the lower surface of the ceramic body, but are not disposed on the upper surface of the ceramic body.SELECTED DRAWING: Figure 1 【課題】本発明は、積層セラミック電子部品及びその実装基板に関する。【解決手段】本発明は、複数の誘電体層を含むセラミック本体と、上記セラミック本体内において上記誘電体層を挟んで上記セラミック本体の両端面に交互に露出するように配置された複数の第1及び第2内部電極を含む活性部と、上記活性部の上部に形成された上部カバー部と、上記活性部の下部に形成され、上記上部カバー部に比べて厚い厚さを有する下部カバー部と、上記第1及び第2内部電極と電気的に連結された第1及び第2外部電極と、を含み、上記第1及び第2外部電極は、上記セラミック本体の長さ方向において両端面を成す両側面と下面に配置されるが、上面には配置されない第1及び第2電極層を含む積層セラミック電子部品を提供する。【選択図】図1