POLYIMIDE, POLYIMIDE LAMINATE, AND FLEXIBLE DEVICE SUBSTRATE
To provide a nanosilica-containing polyamide acid and a nanosilica-containing polyimide each of which is excellent in heat resistance, low thermal expansion and transparency and exhibits low birefringence.SOLUTION: Provided are a polyimide including an acid dianhydride of the following formula (1) a...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a nanosilica-containing polyamide acid and a nanosilica-containing polyimide each of which is excellent in heat resistance, low thermal expansion and transparency and exhibits low birefringence.SOLUTION: Provided are a polyimide including an acid dianhydride of the following formula (1) and a carboxyl group-substituted aromatic diamine structure, and nanosilica surface-treated with an alkoxysilane compound having an amino group.SELECTED DRAWING: None
【課題】耐熱性及び低熱膨張性、更には透明性に優れ、さらに低複屈折を示す、ナノシリカ含有ポリアミド酸及びナノシリカ含有ポリイミドを提供する。【解決手段】下記式(1)で表される酸二無水物及びカルボキシル基置換の芳香族ジアミン構造を含むポリイミドと、アミノ基を持つアルコキシシラン化合物によって表面処理されているナノシリカを含有する。【選択図】なし |
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