SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

To provide a semiconductor device with high reliability.SOLUTION: A semiconductor device includes: a substrate; an electrode layer provided on the substrate; a semiconductor chip including a first side surface part provided on the electrode layer and having a first angle to a substrate surface of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAMAUCHI HIDEAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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