SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

To provide a semiconductor device with high reliability.SOLUTION: A semiconductor device includes: a substrate; an electrode layer provided on the substrate; a semiconductor chip including a first side surface part provided on the electrode layer and having a first angle to a substrate surface of the substrate, and a second side surface part provided below the first side surface part and having a second angle smaller than the first angle to the substrate surface; and resin provided around the electrode layer and the semiconductor chip and in contact with the first side surface part and the second side surface part.SELECTED DRAWING: Figure 1 【課題】信頼性の高い半導体装置を提供する。【解決手段】基板と、基板の上に設けられた電極層と、電極層の上に設けられ、基板の基板面に対して第１角度を取る第１側面部と、第１側面部の下に設けられ、基板面に対して第１角度より小さな第２角度を取る第２側面部と、を有する半導体チップと、電極層及び半導体チップの周囲に設けられ、第１側面部及び第２側面部と接している樹脂と、を備える半導体装置である。【選択図】図１