SUBSTRATE PROCESSING DEVICE AND CLEANING METHOD

To provide a technology that can selectively clean the inside of an injector.SOLUTION: A substrate processing device 1 includes a processing container 11 that accommodates a substrate, an injector 12 that includes a first connection port and a second connection port and communicates with the inside...

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Bibliographische Detailangaben
Hauptverfasser: SON SUNG DUK, HISHIYA SHINGO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a technology that can selectively clean the inside of an injector.SOLUTION: A substrate processing device 1 includes a processing container 11 that accommodates a substrate, an injector 12 that includes a first connection port and a second connection port and communicates with the inside of the processing container, an exhaust pipe 31 that exhausts the inside of the processing container, a raw material gas introduction pipe 121 that is connected to the first connection port and introduces raw material gas into the injector, a cleaning gas introduction pipe 22b that introduces cleaning gas into the injector via one of the first connection port and the second connection port, and a vent pipe 25b that connects the other of the first connection port and the second connection port to the exhaust pipe and exhausts the inside of the injector.SELECTED DRAWING: Figure 1 【課題】インジェクタの内部を選択的にクリーニングできる技術を提供する。【解決手段】基板処理装置1は、基板を収容する処理容器11と、第1の接続口と第2の接続口とを含み、内部が処理容器内と連通するインジェクタ12と、処理容器内を排気する排気管31と、第1の接続口に接続され、インジェクタ内に原料ガスを導入する原料ガス導入管121と、第1の接続口及び第2の接続口の一方を介してインジェクタ内にクリーニングガスを導入するクリーニングガス導入管22bと、第1の接続口及び第2の接続口の他方と排気管とを接続し、インジェクタ内を排気するベント管25bと、を有する。【選択図】図1