SEMICONDUCTOR DEVICE

To provide a semiconductor device having high adhesion between an electrode and a substrate and high reliability to lower on-resistance at the electrode on a surface (rear surface) of the substrate.SOLUTION: A semiconductor device 100 includes a substrate 10 including a semiconductor material, an el...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	EZAKI AKIRA, ONZUKA SHINJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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