SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

To provide a structure of a semiconductor device and a hermetical sealing method with fewer defects in a PIND test.SOLUTION: A method includes: providing a package body 10a including a first recess 18 and a first solder outflow prevention part 26a, each provided on the first sealing surface 16a; pro...

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1. Verfasser:	TSUJI SEIICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a structure of a semiconductor device and a hermetical sealing method with fewer defects in a PIND test.SOLUTION: A method includes: providing a package body 10a including a first recess 18 and a first solder outflow prevention part 26a, each provided on the first sealing surface 16a; providing a cap 92 having a second sealing surface 16b facing the first sealing surface 16a; placing a ball solder 60 in the first recess 18; placing the cap 92 on the ball solder 60; and as a hermetical sealing step, melting once and then solidifying the ball solder 60 to bond the first sealing surface 16a and the second sealing surface 16b to each other.SELECTED DRAWING: Figure 7 【課題】ＰＩＮＤ試験不良が低減された半導体装置の構造と半導体装置の気密封止方法を提供すること提供することを目的とする。【解決手段】第１のシール面１６ａに第１の窪み１８と第１のはんだ流れ出し防止部２６ａを備えたパッケージ本体１０ａを用意する工程と、第１のシール面１６ａに対向する第２のシール面１６ｂを備えたキャップ９２を用意する工程と、第１の窪み１８にボールはんだ６０を載置する工程と、ボールはんだ６０にキャップ９２を載置する工程と、ボールはんだ６０を一旦溶融しその後凝固させて第１のシール面１６ａと第２のシール面１６ｂとを接合させる気密封止工程を備える。【選択図】図７