ACTIVE BRIDGE ENABLED CO-PACKAGED PHOTONIC TRANSCEIVER

To co-package optics on a microelectronic package with a processor or other active die.SOLUTION: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicativel...

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Hauptverfasser:	LIAO LING, RAVINDRANATH MAHAJAN, BHARADWAJ PARTHASARATHY, THOMAS LILJEBERG, NITIN A DESHPANDE, ANDREW C ALDUINO, JAMES JAUSSI, KENNETH BROWN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	To co-package optics on a microelectronic package with a processor or other active die.SOLUTION: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.SELECTED DRAWING: Figure 1 【課題】プロセッサ又は他のアクティブ・ダイと一緒に超小型電子パッケージ上に光学系を一緒にパッケージングすること。【解決手段】実施形態は、アクティブ・ブリッジがその中に位置付けされるパッケージ基板を含む超小型電子パッケージに関係し得る。アクティブ・ダイが、パッケージ基板と結合され、アクティブ・ブリッジと通信可能に結合され得る。フォトニック集積回路（ＰＩＣ）がまた、パッケージ基板と結合され、アクティブ・ブリッジと通信可能に結合され得る。他の実施形態が、記載又は請求され得る。【選択図】図１