SOLDERING FLUX COMPOSITION

To provide a soldering flux composition of which flux residue can be removed by water washing and which has excellent solderability with respect to iron and can sufficiently suppress solder projection.SOLUTION: A soldering flux composition includes (A) a solvent and (B) an activator. The (A) composi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	AMINO DAIKI, KUMAKURA ICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a soldering flux composition of which flux residue can be removed by water washing and which has excellent solderability with respect to iron and can sufficiently suppress solder projection.SOLUTION: A soldering flux composition includes (A) a solvent and (B) an activator. The (A) composition is at least one selected from the group comprising water and alcohol. The (B) composition includes (B1) glutaric acid and (B2) 2,2'-oxy diacetic acid.SELECTED DRAWING: None 【課題】フラックス残さを水洗により除去でき、鉄に対するはんだ付け性に優れ、かつはんだつららを十分に抑制できるはんだ付け用フラックス組成物を提供すること。【解決手段】本発明のはんだ付け用フラックス組成物は、（Ａ）溶媒と、（Ｂ）活性剤と、を含有するフラックス組成物であって、前記（Ａ）成分は、水、およびアルコールからなる群から選択される少なくとも１つであり、前記（Ｂ）成分は、（Ｂ１）グルタル酸と、（Ｂ２）２，２'−オキシ二酢酸と、を含有することを特徴とする。【選択図】なし