SEMICONDUCTOR DEVICE

To provide a semiconductor device in which crack in an adhesive layer for attaching a semiconductor chip to a wiring board and the resulting fracture of a board wire can be suppressed.SOLUTION: A semiconductor device 1 according to an embodiment includes a wiring board 2, a first semiconductor chip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AMANO AYANA, WATANABE TAKESHI, SUGAO YUKI, HATTORI KEIICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a semiconductor device in which crack in an adhesive layer for attaching a semiconductor chip to a wiring board and the resulting fracture of a board wire can be suppressed.SOLUTION: A semiconductor device 1 according to an embodiment includes a wiring board 2, a first semiconductor chip 3 mounted in the wiring board 2, and an adhesive layer 4 for attaching the first semiconductor chip 3 to the wiring board 2. The adhesive layer 4 includes a resin-containing material whose fracture strength at 125°C is 15 MPa or more.SELECTED DRAWING: Figure 1 【課題】半導体チップを配線基板に接着する接着層の亀裂及びそれに起因する基板配線の断裂等を抑制することを可能にした半導体装置を提供する。【解決手段】実施形態の半導体装置１は、配線基板２と、配線基板２に搭載された第１の半導体チップ３と、第１の半導体チップ３を配線基板２に接着する接着層４とを具備する。接着層４は、１２５℃における破壊強度が１５ＭＰａ以上の樹脂含有材を含む。【選択図】図１