DIE BONDING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To provide a technique capable of improving the uniformity of imaging conditions of a plurality of imaging objects.SOLUTION: A die bonding device includes a transport path for transporting a substrate, a plurality of imaging devices fixedly arranged in a row above the transport path along the width direction of the substrate, and a control unit which is configured to acquire a plurality of images by imaging multiple attachment areas in a row along the width direction located on the substrate by a plurality of imaging devices, to generate a composite image on the basis of the acquired multiple images, and to recognize an imaged object in the attachment area on the basis of the composite image. The imaging fields of view of the respective imaging devices overlap on the substrate, and the overlapping imaging fields of view are configured to be larger than the attachment area.SELECTED DRAWING: Figure 7 【課題】複数の撮像対象物の撮像条件の一様性を向上することが可能な技術を提供することにある。【解決手段】ダイボンディング装置は、基板を搬送する搬送路と、搬送路の上方に基板の幅方向に沿って一列に固定配設された複数の撮像装置と、基板の上に位置する幅方向に沿った一列の複数のアタッチメント領域を複数の撮像装置で撮像して複数の画像を取得し、取得した複数の画像に基づいて合成画像を生成し、合成画像に基づいてアタッチメント領域の撮像対象物を認識するよう構成される制御部と、を備える。各撮像装置の撮像視野は基板の上で重複し、重複した撮像視野はアタッチメント領域よりも大きく構成される。【選択図】図７