PRESSURE DEVICE, MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR DEVICE ARRAY

To provide a pressure device, manufacturing apparatus and manufacturing method for device array, capable of stably manufacturing a device array on a packaging substrate.SOLUTION: A pressure device 10 for device array includes a pressure plate 11 with a pressure part 12 for pressing a device array 40...

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Hauptverfasser:	SHINDO OSAMU, MIYAKOSHI TOSHINOBU, KATO YASUO, KOIZUMI HIROSHI, YAMASHITA MAKOTO, SUNAGA SEIJURO, SHINDO RYO, IIZUKA HIROSHI, MAKITA KOETSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a pressure device, manufacturing apparatus and manufacturing method for device array, capable of stably manufacturing a device array on a packaging substrate.SOLUTION: A pressure device 10 for device array includes a pressure plate 11 with a pressure part 12 for pressing a device array 40 constituted of a plurality of elements 40a-40c arranged on a packaging substrate 30. The pressure part 12 has a plate-like hard material 13 with higher surface accuracy than the surface of the pressure plate 11.SELECTED DRAWING: Figure 1 【課題】素子アレイを安定して実装基板上に製造することが可能な素子アレイの加圧装置、製造装置および製造方法を提供する。【解決手段】素子アレイの加圧装置１０は、実装基板３０に配置された複数の素子４０ａ〜４０ｃからなる素子アレイ４０を加圧する加圧部１２を持つ加圧プレート１１を有する。加圧部１２は、加圧プレート１１の表面よりも表面精度が高い板状の硬質材１３を有する。【選択図】図１