WIRING CIRCUIT BOARD

To provide a wiring circuit board that can reinforce a connection part and can stably control the deformation of the wiring circuit board.SOLUTION: A suspension substrate 1 with a circuit extending in a predetermined direction includes a base insulating layer 3 and a conductor layer 4 arranged on on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AZUMA TAKAHITO, FUJIMURA HIROTO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a wiring circuit board that can reinforce a connection part and can stably control the deformation of the wiring circuit board.SOLUTION: A suspension substrate 1 with a circuit extending in a predetermined direction includes a base insulating layer 3 and a conductor layer 4 arranged on one side of the base insulating layer 3 in a thickness direction. The base insulating layer 3 includes a first main body base 31 and a second main body base 32 that are arranged at intervals in the width direction, and a connecting portion 33 connecting a part of the first main body base 31 in a longitudinal direction and a part of the second main body base 32 in the longitudinal direction. Then, the suspension substrate 1 with the circuit further includes a reinforcing portion 10 that is arranged on the surface of the connecting portion 33 and reinforces the connecting portion 33. The reinforcing portion 10 includes two or more resin layers or metal members laminated in the thickness direction.SELECTED DRAWING: Figure 1 【課題】連結部分を補強でき、配線回路基板の変形を安定して制御できる配線回路基板を提供すること。【解決手段】所定方向に延びる回路付サスペンション基板1に、ベース絶縁層3と、ベース絶縁層3の厚み方向の一方側に配置される導体層4とを備える。ベース絶縁層3に、幅方向に互いに間隔を空けて配置される第1本体ベース31および第2本体ベース32と、長手方向における第1本体ベース31の一部、および、長手方向における第2本体ベース32の一部を連結する連結部分33とを備える。そして、回路付サスペンション基板1に、連結部分33の表面に配置され、連結部分33を補強する補強部10をさらに備える。補強部10に、厚み方向に積層される2つ以上の樹脂層、または、金属部材を備える。【選択図】図1