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To provide an assembly which has low transition resistance and can be manufactured easily and at low cost.SOLUTION: The present invention relates to an assembly (1) for components (10, 20) which conduct a current from a current supply component to a current send-out component. The first component (1...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide an assembly which has low transition resistance and can be manufactured easily and at low cost.SOLUTION: The present invention relates to an assembly (1) for components (10, 20) which conduct a current from a current supply component to a current send-out component. The first component (10) contains a first metal material and includes at least one spring elastic thin piece (3) made of the first metal material on a surface. The thin piece is monolithically connected with the first component (10) in a connection region and made of the first metal material on the surface of the first component (10) so as to extend to a free end with the connection region defined as a departure point and so as to apply a spring force which is directed away from the surface of the component (10) in the case where the thin piece is displaced from a stationary state in a direction of the surface of the first component (10). The assembly further comprises the second component (20) in direct contact with at least one thin piece (3) of the first component (10).SELECTED DRAWING: Figure 3
【課題】小さい遷移抵抗を有するとともに簡単かつ安価に製造できるアセンブリを提供する。【解決手段】電流を電流供給部品から電流送出部品へ伝導する部品(10、20)のアセンブリ(1)であって、第1部品(10)が第1金属材料を含み、表面上に、第1金属材料からなる少なくとも1つのばね弾性薄片(3)を有し、薄片が接続領域において第1部品(10)とモノリシックに接続されているとともに、接続領域を出発点として自由端まで延在するように、かつ薄片が静止状態から第1部品(10)の表面の方向に変位した場合に部品(10)の表面から離れる方を向いたばね力を加えるように、第1部品(10)の表面の第1金属材料から作り出されており、アセンブリが、第1部品(10)の少なくとも1つの薄片(3)と直接接触する第2部品(20)をさらに備える、アセンブリに関する。【選択図】図3 |
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