VARNISH COMPOSITION, AND METHOD FOR PRODUCING POLYIMIDE RESIN

To provide a varnish composition that allows a polyamic acid to dissolve properly and prevents a bad odor from occurring during storage of the varnish composition or when the varnish composition is used to form a polyimide resin, and a method for producing a polyimide resin using the varnish composi...

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Bibliographische Detailangaben
Hauptverfasser:	IKUMA NAOHIKO, SHIODA MASARU, TADOKORO KEISUKE, FUJINAMI TETSURO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a varnish composition that allows a polyamic acid to dissolve properly and prevents a bad odor from occurring during storage of the varnish composition or when the varnish composition is used to form a polyimide resin, and a method for producing a polyimide resin using the varnish composition.SOLUTION: The present disclosure provides a varnish composition for polyimide resin formation containing polyamic acid, in which as solvents (S) blended are a nitrogen-containing organic solvent (S-I) of a specific structure and a sulfur-containing organic solvent (S-II) of a specific structure.SELECTED DRAWING: None 【課題】ポリアミック酸が良好に溶解し、且つ、ワニス組成物の保管時や、ワニス組成物を用いてポリイミド樹脂を形成する際に、臭気が生じにくいワニス組成物と、当該ワニス組成物を用いるポリイミド樹脂の製造方法とを提供すること。【解決手段】ポリアミック酸を含有するポリイミド樹脂形成用のワニス組成物において、溶媒（Ｓ）として、それぞれ特定の構造の、含窒素有機溶媒（Ｓ−Ｉ）と、含硫黄有機溶媒（Ｓ−ＩＩ）とを配合する。【選択図】なし