RESIN COMPOSITION AND SOLUTION OF THE SAME

To provide a thermosetting resin composition which is excellent in low dielectric characteristics in a high-frequency region even with simple operation and a cured product of the same, and a laminate for an electric/electronic circuit composed of the composition.SOLUTION: A resin composition contain...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ISHIHARA TOSHIHISA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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