ELECTRONIC COMPONENT PACKAGING COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

To provide a cover tape which can be suitably heat-sealed to various kinds of carrier tapes.SOLUTION: An electronic component packaging cover tape 1 comprises a base material layer 14, and a sealant layer 11 provided on one surface side thereof. The base material layer contains polyester, and has a thickness of 5 to 30 μm. When an average value of peel strength under [condition 1] is represented by FLow, an average value of peel strength under [condition 2] is represented by FHigh, FHigh/FLow is 2 to 5. [Condition 1] seal condition: a long object, which is formed in such a manner that the cover tape is slitted to a width of 5.3 mm, is brought into contact with a surface of a sheet for a carrier tape on a surface thereof on the sealant layer side, and is heat-sealed under the condition of 160°C, 4 kg/cm2, 0.1 second to obtain a complex. Peel condition: the composite is peeled under the condition of a peel rate of 300 mm/min, a peel angle of 180°. [Condition 2] this condition is same as the condition 1 except that a heat sealing temperature is set to 200°C.SELECTED DRAWING: Figure 1 【課題】様々な種類のキャリアテープに適切にヒートシール可能なカバーテープを提供する。【解決手段】基材層１４と、一方の面側に設けられたシーラント層１１とを備える電子部品包装用カバーテープ１。基材層は、ポリエステルを含み、５〜３０μｍの厚みを有する。［条件１］の剥離強度の平均値をＦＬｏｗ、［条件２］の剥離強度の平均値をＦＨｉｇｈとしたとき、ＦＨｉｇｈ／ＦＬｏｗは２〜５である。［条件１］シール条件：カバーテープを５．３ｍｍ幅にスリットして長尺状としたものを、シーラント層側の面で、キャリアテープ用シートの表面と接触させ、そして、１６０℃、４ｋｇ／ｃｍ２、０．１秒の条件で熱シールし、複合体を得る。剥離条件：複合体を、剥離速度３００ｍｍ／ｍｉｎ、剥離角度１８０°の条件で剥離。［条件２］熱シールの温度を２００℃とする以外は、［条件１］と同じ条件。【選択図】図１