LASER PROCESSING DEVICE AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE
To provide a laser processing device that can reduce processing objects to be disposed due to processing failure.SOLUTION: A laser processing device (2) includes: an irradiation part (240); a receiving part (216) for receiving a processing pattern and an irradiation condition on a laser beam (W); an...
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| creator | SAKAMOTO TATSUNORI YOKOI TADAMASA TSUCHIMICHI KAZUMI YOSHITAKE NAOKI ASHIHARA KATSUMITSU |
| description | To provide a laser processing device that can reduce processing objects to be disposed due to processing failure.SOLUTION: A laser processing device (2) includes: an irradiation part (240); a receiving part (216) for receiving a processing pattern and an irradiation condition on a laser beam (W); and a control unit (211) for controlling irradiation with the laser beam (W) on the basis of the processing pattern and the irradiation condition received by the receiving part (216) and irradiation condition. The control unit (211) performs first processing of processing at least part of a first processing region (P) of a processing object (8) into a reverse pattern in which an irradiation region with the laser beam (W) and a non-irradiation region with the laser beam (W) in the processing pattern are reversed.SELECTED DRAWING: Figure 6
【課題】加工の失敗により廃棄される加工対象物を減らすことができるレーザ加工装置を提供する。【解決手段】レーザ加工装置（２）は、照射部（２４０）と、加工パターンおよびレーザ光（Ｗ）の照射条件を受け付ける受付部（２１６）と、受付部（２１６）で受け付けた加工パターンおよび照射条件に基づいて、レーザ光（Ｗ）の照射を制御する制御部（２１１）とを備える。制御部（２１１）は、加工対象物（８）の第１加工領域（Ｐ）の少なくとも一部を、加工パターンのレーザ光（Ｗ）の照射領域とレーザ光（Ｗ）の非照射領域とを反転させた反転パターンに加工する第１処理を行う。【選択図】図６ |
| format | Patent |
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【課題】加工の失敗により廃棄される加工対象物を減らすことができるレーザ加工装置を提供する。【解決手段】レーザ加工装置（２）は、照射部（２４０）と、加工パターンおよびレーザ光（Ｗ）の照射条件を受け付ける受付部（２１６）と、受付部（２１６）で受け付けた加工パターンおよび照射条件に基づいて、レーザ光（Ｗ）の照射を制御する制御部（２１１）とを備える。制御部（２１１）は、加工対象物（８）の第１加工領域（Ｐ）の少なくとも一部を、加工パターンのレーザ光（Ｗ）の照射領域とレーザ光（Ｗ）の非照射領域とを反転させた反転パターンに加工する第１処理を行う。【選択図】図６</description><language>eng ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210916&DB=EPODOC&CC=JP&NR=2021137823A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210916&DB=EPODOC&CC=JP&NR=2021137823A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAMOTO TATSUNORI</creatorcontrib><creatorcontrib>YOKOI TADAMASA</creatorcontrib><creatorcontrib>TSUCHIMICHI KAZUMI</creatorcontrib><creatorcontrib>YOSHITAKE NAOKI</creatorcontrib><creatorcontrib>ASHIHARA KATSUMITSU</creatorcontrib><title>LASER PROCESSING DEVICE AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE</title><description>To provide a laser processing device that can reduce processing objects to be disposed due to processing failure.SOLUTION: A laser processing device (2) includes: an irradiation part (240); a receiving part (216) for receiving a processing pattern and an irradiation condition on a laser beam (W); and a control unit (211) for controlling irradiation with the laser beam (W) on the basis of the processing pattern and the irradiation condition received by the receiving part (216) and irradiation condition. The control unit (211) performs first processing of processing at least part of a first processing region (P) of a processing object (8) into a reverse pattern in which an irradiation region with the laser beam (W) and a non-irradiation region with the laser beam (W) in the processing pattern are reversed.SELECTED DRAWING: Figure 6
【課題】加工の失敗により廃棄される加工対象物を減らすことができるレーザ加工装置を提供する。【解決手段】レーザ加工装置（２）は、照射部（２４０）と、加工パターンおよびレーザ光（Ｗ）の照射条件を受け付ける受付部（２１６）と、受付部（２１６）で受け付けた加工パターンおよび照射条件に基づいて、レーザ光（Ｗ）の照射を制御する制御部（２１１）とを備える。制御部（２１１）は、加工対象物（８）の第１加工領域（Ｐ）の少なくとも一部を、加工パターンのレーザ光（Ｗ）の照射領域とレーザ光（Ｗ）の非照射領域とを反転させた反転パターンに加工する第１処理を行う。【選択図】図６</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDycQx2DVIICPJ3dg0O9vRzV3BxDfN0dlVw9HNR8HUN8fB3UXDzD1Jw9vcLCfL38QGpwKGFh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRgZGhqbWxgZOxoTpQgAtW8tzQ</recordid><startdate>20210916</startdate><enddate>20210916</enddate><creator>SAKAMOTO TATSUNORI</creator><creator>YOKOI TADAMASA</creator><creator>TSUCHIMICHI KAZUMI</creator><creator>YOSHITAKE NAOKI</creator><creator>ASHIHARA KATSUMITSU</creator><scope>EVB</scope></search><sort><creationdate>20210916</creationdate><title>LASER PROCESSING DEVICE AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE</title><author>SAKAMOTO TATSUNORI ; YOKOI TADAMASA ; TSUCHIMICHI KAZUMI ; YOSHITAKE NAOKI ; ASHIHARA KATSUMITSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021137823A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAMOTO TATSUNORI</creatorcontrib><creatorcontrib>YOKOI TADAMASA</creatorcontrib><creatorcontrib>TSUCHIMICHI KAZUMI</creatorcontrib><creatorcontrib>YOSHITAKE NAOKI</creatorcontrib><creatorcontrib>ASHIHARA KATSUMITSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAMOTO TATSUNORI</au><au>YOKOI TADAMASA</au><au>TSUCHIMICHI KAZUMI</au><au>YOSHITAKE NAOKI</au><au>ASHIHARA KATSUMITSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING DEVICE AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE</title><date>2021-09-16</date><risdate>2021</risdate><abstract>To provide a laser processing device that can reduce processing objects to be disposed due to processing failure.SOLUTION: A laser processing device (2) includes: an irradiation part (240); a receiving part (216) for receiving a processing pattern and an irradiation condition on a laser beam (W); and a control unit (211) for controlling irradiation with the laser beam (W) on the basis of the processing pattern and the irradiation condition received by the receiving part (216) and irradiation condition. The control unit (211) performs first processing of processing at least part of a first processing region (P) of a processing object (8) into a reverse pattern in which an irradiation region with the laser beam (W) and a non-irradiation region with the laser beam (W) in the processing pattern are reversed.SELECTED DRAWING: Figure 6
【課題】加工の失敗により廃棄される加工対象物を減らすことができるレーザ加工装置を提供する。【解決手段】レーザ加工装置（２）は、照射部（２４０）と、加工パターンおよびレーザ光（Ｗ）の照射条件を受け付ける受付部（２１６）と、受付部（２１６）で受け付けた加工パターンおよび照射条件に基づいて、レーザ光（Ｗ）の照射を制御する制御部（２１１）とを備える。制御部（２１１）は、加工対象物（８）の第１加工領域（Ｐ）の少なくとも一部を、加工パターンのレーザ光（Ｗ）の照射領域とレーザ光（Ｗ）の非照射領域とを反転させた反転パターンに加工する第１処理を行う。【選択図】図６</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER PROCESSING DEVICE AND METHOD FOR CONTROLLING LASER PROCESSING DEVICE |
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