HEAT RADIATOR

To provide a heat radiator which can simultaneously contact with heating components which are mounted on a circuit board having a difference in height.SOLUTION: In a heat radiator 100, a heat conductive member 110 has: a heat radiation side 110a; and a heat absorption side 110b opposite to the heat...

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Bibliographische Detailangaben
Hauptverfasser: CHEN HUNGNG, LIAO TSE-HSINE
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a heat radiator which can simultaneously contact with heating components which are mounted on a circuit board having a difference in height.SOLUTION: In a heat radiator 100, a heat conductive member 110 has: a heat radiation side 110a; and a heat absorption side 110b opposite to the heat radiation side 110a. Further, the heat absorption side 110a comprises at least two contact planes S1, S2. The at least two contact planes S1, S2 are parallel to each other and a height difference exists between the at least two contact planes S1, S2. Further, the heat absorption side 110b faces heating components HS1, HS2.SELECTED DRAWING: Figure 4 【課題】回路基板に実装されている高低差のある発熱部品に対しても同時に接触できる放熱装置を提供する。【解決手段】放熱装置100において、熱伝導性部材110は、放熱側110aと、この放熱側110aとは反対側の面である吸熱側110bを有する。また、吸熱側110bは少なくとも2個の接触平面S1、S2によって構成され、少なくとも2個の接触平面S1、S2は互いに平行であり、且つ、少なくとも2個の接触平面S1、S2の間には高低差がある。また、吸熱側110bは発熱部品HS1、HS2に面する。【選択図】図4