COIL COMPONENT AND ELECTRONIC APPARATUS

To improve adhesion between a glass epoxy substrate and a resin wall.SOLUTION: A coil component includes: a glass epoxy substrate; a planar coil conductor which is provided on the glass epoxy substrate and is made of a metal element or an alloy of the metal element; an insulating film containing sil...

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description To improve adhesion between a glass epoxy substrate and a resin wall.SOLUTION: A coil component includes: a glass epoxy substrate; a planar coil conductor which is provided on the glass epoxy substrate and is made of a metal element or an alloy of the metal element; an insulating film containing silicon which is provided on the glass epoxy substrate in contact with the glass epoxy substrate; and a resin wall which is provided on the glass epoxy substrate in contact with the insulating film containing silicon and extends between winding portions of the coil conductor.SELECTED DRAWING: Figure 2 【課題】ガラスエポキシ基板と樹脂壁の密着性を向上させること。【解決手段】ガラスエポキシ基板と、前記ガラスエポキシ基板上に設けられ、金属元素又は前記金属元素の合金からなる平面状のコイル導体と、前記ガラスエポキシ基板上に前記ガラスエポキシ基板に接して設けられる、シリコンを含む絶縁膜と、前記ガラスエポキシ基板上に、前記シリコンを含む絶縁膜に接して設けられ、前記コイル導体の巻回部の間に延在する樹脂壁と、を備える、コイル部品。【選択図】図2
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an insulating film containing silicon which is provided on the glass epoxy substrate in contact with the glass epoxy substrate; and a resin wall which is provided on the glass epoxy substrate in contact with the insulating film containing silicon and extends between winding portions of the coil conductor.SELECTED DRAWING: Figure 2 【課題】ガラスエポキシ基板と樹脂壁の密着性を向上させること。【解決手段】ガラスエポキシ基板と、前記ガラスエポキシ基板上に設けられ、金属元素又は前記金属元素の合金からなる平面状のコイル導体と、前記ガラスエポキシ基板上に前記ガラスエポキシ基板に接して設けられる、シリコンを含む絶縁膜と、前記ガラスエポキシ基板上に、前記シリコンを含む絶縁膜に接して設けられ、前記コイル導体の巻回部の間に延在する樹脂壁と、を備える、コイル部品。【選択図】図2</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210913&amp;DB=EPODOC&amp;CC=JP&amp;NR=2021136395A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210913&amp;DB=EPODOC&amp;CC=JP&amp;NR=2021136395A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOYAGI YOSHIO</creatorcontrib><title>COIL COMPONENT AND ELECTRONIC APPARATUS</title><description>To improve adhesion between a glass epoxy substrate and a resin wall.SOLUTION: A coil component includes: a glass epoxy substrate; 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subjects BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
title COIL COMPONENT AND ELECTRONIC APPARATUS
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