ULTRASONIC CLEANING METHOD

To suppress damage of a cleaning object and to clean the cleaning object by simple constitution.SOLUTION: An ultrasonic cleaning method includes: a cleaning liquid application step (S101) for applying cleaning liquid to a surface of an electronic component held on a cleaning stage; a peeling step (S...

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Bibliographische Detailangaben
Hauptverfasser: MICHAEL KIRKBY, LANDAEZ GARCIA YSMALDO JOSE, MUNAKATA HIROSHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To suppress damage of a cleaning object and to clean the cleaning object by simple constitution.SOLUTION: An ultrasonic cleaning method includes: a cleaning liquid application step (S101) for applying cleaning liquid to a surface of an electronic component held on a cleaning stage; a peeling step (S103) for peeling a foreign material stuck to the surface of the electronic component coated with the cleaning liquid from the surface by applying an ultrasonic wave from an ultrasonic wave speaker attached to an acoustic head to the surface of the electronic component; and a suction step (S104) for forming a low-pressure region whose pressure is lower than atmospheric pressure on the center lower section of a casing by concentrating an ultrasonic wave generated from the ultrasonic wave speaker into a cavity between the casing and a holding surface of the cleaning stage and sucking a foreign material peeled off from the surface of the electronic component and the cleaning liquid applied to the surface into the low-pressure region.SELECTED DRAWING: Figure 2 【課題】洗浄対象物の損傷を抑制すると共に簡便な構成で洗浄対象物の洗浄を行う。【解決手段】洗浄ステージに保持された電子部品の表面に洗浄液を塗布する洗浄液塗布工程(S101)と、音響ヘッドに取付けられた超音波スピーカーから超音波を洗浄液塗布され電子部品の表面に照射して、表面に付着している異物を表面から剥離させる剥離工程(S103)と、超音波スピーカーから発生した超音波をケーシングと洗浄ステージの保持面との間の空隙で集中させてケーシングの中央下部に大気圧よりも圧力が低い低圧領域を形成し、電子部品の表面から剥離した異物と表面に塗布された洗浄液とを低圧領域に吸引する吸引工程(S104)と、を有する。【選択図】図2