CORRECTION-POLISHING PROCESSING METHOD AND CORRECTION-POLISHING PROCESSING DEVICE

To provide a correction-polishing processing method and a correction-polishing processing device which can suppress occurrence of streaks in a static processing trace, and do not cause anisotropy in surface roughness even when increasing scanning pitch of correction-polishing processing, so that efficiency in processing can be improved.SOLUTION: A correction-polishing processing method, which performs scanning processing by numerically controlling a rotary tool 2 that can perform polishing processing locally, while supplying slurry polishing processing liquid 8, processes a work-piece 90 while oscillating the work-piece. A vibration frequency of the oscillation is 0.1 Hz or more and amplitude of vibration is 1 μm or more. In the polishing processing liquid, abrasive grain made of organic particles whose average particle size is 5 μm or more are dispersed in liquid, which is composed mainly of pure water or water.SELECTED DRAWING: Figure 1 【課題】静止加工痕での縞の発生を抑え、修正研磨加工の走査ピッチを上げても表面粗さに異方性が出ず、加工の効率化を図ることができる修正研磨加工方法および修正研磨加工装置を提供せんとする。【解決手段】局所的に研磨加工可能な回転ツール２を、スラリー状の研磨加工液８を間に供給しつつ、数値制御で走査加工する修正研磨加工方法において、ワーク９０を揺動させながら加工する。揺動の振動数は０．１Ｈｚ以上、振幅は１μｍ以上とした。研磨加工液は平均粒径５μｍ以上の有機粒子からなる砥粒を液体中に分散させた研磨加工液とし、純水または水を主成分とした。【選択図】図１