SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
To provide a technology that can suppress the generation of cutting debris and also suppress the reduction of dimensional accuracy of lead frames.SOLUTION: A semiconductor manufacturing apparatus 1 comprises a punch 6 having a tip 6a that cuts a tie bar portion 3 of a lead frame 2, a punch guide 8 t...
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| creator | ICHIKAWA KEITARO SHIKASHO YUJI KAWAHARA FUMIHITO |
| description | To provide a technology that can suppress the generation of cutting debris and also suppress the reduction of dimensional accuracy of lead frames.SOLUTION: A semiconductor manufacturing apparatus 1 comprises a punch 6 having a tip 6a that cuts a tie bar portion 3 of a lead frame 2, a punch guide 8 that supports the punch 6 so that it can be moved between a cutting start position and a cutting position that is located below the cutting start position, and a die 7 that has a recess 7a into which the tip 6a of the punch 6 is inserted in a state that the punch 6 is in the cutting position, and sandwiches and fixes the tie bar portion 3 with the punch guide 8. The tip 6a of the punch 6 is a convex shape that protrudes downward.SELECTED DRAWING: Figure 2
【課題】切断屑の発生を抑制し、かつ、リードフレームの寸法精度の低下を抑制できる技術を提供することを目的とする。【解決手段】半導体製造装置１は、リードフレーム２のタイバー部３を切断する先端部６ａを有するパンチ６と、切断開始位置と切断開始位置よりも下方に位置する切断位置との間で移動可能なようにパンチ６を支持するパンチガイド８と、パンチ６が切断位置にある状態でパンチ６の先端部６ａが挿入される凹部７ａを有し、パンチガイド８とでタイバー部３を挟んで固定するダイ７とを備え、パンチ６の先端部６ａは下方に突出する凸形状である。【選択図】図２ |
| format | Patent |
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【課題】切断屑の発生を抑制し、かつ、リードフレームの寸法精度の低下を抑制できる技術を提供することを目的とする。【解決手段】半導体製造装置１は、リードフレーム２のタイバー部３を切断する先端部６ａを有するパンチ６と、切断開始位置と切断開始位置よりも下方に位置する切断位置との間で移動可能なようにパンチ６を支持するパンチガイド８と、パンチ６が切断位置にある状態でパンチ６の先端部６ａが挿入される凹部７ａを有し、パンチガイド８とでタイバー部３を挟んで固定するダイ７とを備え、パンチ６の先端部６ａは下方に突出する凸形状である。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PUNCHING METAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210902&DB=EPODOC&CC=JP&NR=2021129065A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210902&DB=EPODOC&CC=JP&NR=2021129065A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHIKAWA KEITARO</creatorcontrib><creatorcontrib>SHIKASHO YUJI</creatorcontrib><creatorcontrib>KAWAHARA FUMIHITO</creatorcontrib><title>SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><description>To provide a technology that can suppress the generation of cutting debris and also suppress the reduction of dimensional accuracy of lead frames.SOLUTION: A semiconductor manufacturing apparatus 1 comprises a punch 6 having a tip 6a that cuts a tie bar portion 3 of a lead frame 2, a punch guide 8 that supports the punch 6 so that it can be moved between a cutting start position and a cutting position that is located below the cutting start position, and a die 7 that has a recess 7a into which the tip 6a of the punch 6 is inserted in a state that the punch 6 is in the cutting position, and sandwiches and fixes the tie bar portion 3 with the punch guide 8. The tip 6a of the punch 6 is a convex shape that protrudes downward.SELECTED DRAWING: Figure 2
【課題】切断屑の発生を抑制し、かつ、リードフレームの寸法精度の低下を抑制できる技術を提供することを目的とする。【解決手段】半導体製造装置１は、リードフレーム２のタイバー部３を切断する先端部６ａを有するパンチ６と、切断開始位置と切断開始位置よりも下方に位置する切断位置との間で移動可能なようにパンチ６を支持するパンチガイド８と、パンチ６が切断位置にある状態でパンチ６の先端部６ａが挿入される凹部７ａを有し、パンチガイド８とでタイバー部３を挟んで固定するダイ７とを備え、パンチ６の先端部６ａは下方に突出する凸形状である。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PUNCHING METAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgPdvX1dPb3cwl1DvEPUvB19At1c3QOCQ3y9HNXcAwIcAxyDAkNVnD0c1HwdQ3x8HdRcMNQhmqEi2uYp7MrDwNrWmJOcSovlOZmUHJzDXH20E0tyI9PLS5ITE7NSy2J9wowMjAyNDSyNDAzdTQmShEAb6sx7A</recordid><startdate>20210902</startdate><enddate>20210902</enddate><creator>ICHIKAWA KEITARO</creator><creator>SHIKASHO YUJI</creator><creator>KAWAHARA FUMIHITO</creator><scope>EVB</scope></search><sort><creationdate>20210902</creationdate><title>SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><author>ICHIKAWA KEITARO ; SHIKASHO YUJI ; KAWAHARA FUMIHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021129065A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PUNCHING METAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>ICHIKAWA KEITARO</creatorcontrib><creatorcontrib>SHIKASHO YUJI</creatorcontrib><creatorcontrib>KAWAHARA FUMIHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ICHIKAWA KEITARO</au><au>SHIKASHO YUJI</au><au>KAWAHARA FUMIHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><date>2021-09-02</date><risdate>2021</risdate><abstract>To provide a technology that can suppress the generation of cutting debris and also suppress the reduction of dimensional accuracy of lead frames.SOLUTION: A semiconductor manufacturing apparatus 1 comprises a punch 6 having a tip 6a that cuts a tie bar portion 3 of a lead frame 2, a punch guide 8 that supports the punch 6 so that it can be moved between a cutting start position and a cutting position that is located below the cutting start position, and a die 7 that has a recess 7a into which the tip 6a of the punch 6 is inserted in a state that the punch 6 is in the cutting position, and sandwiches and fixes the tie bar portion 3 with the punch guide 8. The tip 6a of the punch 6 is a convex shape that protrudes downward.SELECTED DRAWING: Figure 2
【課題】切断屑の発生を抑制し、かつ、リードフレームの寸法精度の低下を抑制できる技術を提供することを目的とする。【解決手段】半導体製造装置１は、リードフレーム２のタイバー部３を切断する先端部６ａを有するパンチ６と、切断開始位置と切断開始位置よりも下方に位置する切断位置との間で移動可能なようにパンチ６を支持するパンチガイド８と、パンチ６が切断位置にある状態でパンチ６の先端部６ａが挿入される凹部７ａを有し、パンチガイド８とでタイバー部３を挟んで固定するダイ７とを備え、パンチ６の先端部６ａは下方に突出する凸形状である。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SEMICONDUCTOR DEVICES TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
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