METHOD FOR ADHERING SOI WAFER

To provide a method for adhering, so that its diameter variance surely becomes a projection part of an active side wafer in the adhesion with an active side wafer having a diameter larger than that of a support side wafer even in the case where both diameter variances are small.SOLUTION: In a method...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MORIKAWA YASUYUKI, HIROSHIGE TAKESHI, OKABE HIDEMITSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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