POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM/BASE MATERIAL LAMINATE

To provide a polyimide precursor composition that makes it possible to produce a polyimide film/base material laminate with small warpage and has excellent stability.SOLUTION: A polyimide precursor composition includes at least one imidazole compound that is selected from 2-phenylimidazole and benzi...

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Bibliographische Detailangaben
Hauptverfasser:	OKA TAKUYA, KOHAMA YUKINORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS PRINTED CIRCUITS TESTING THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a polyimide precursor composition that makes it possible to produce a polyimide film/base material laminate with small warpage and has excellent stability.SOLUTION: A polyimide precursor composition includes at least one imidazole compound that is selected from 2-phenylimidazole and benzimidazole and is contained in an amount ranging from more than 0.01 mol to less than 1 mol relative to 1 mol of a repeating unit of a polyimide precursor, and a solvent.SELECTED DRAWING: None 【課題】反りの小さいポリイミドフィルム／基材積層体を製造することが可能で、且つ安定性に優れたポリイミド前駆体組成物を提供する。【解決手段】ポリイミド前駆体の繰り返し単位１モルに対して、０．０１モル超から１モル未満の範囲の量で含有され、且つ２−フェニルイミダゾールおよびベンゾイミダゾールから選ばれる少なくとも１つのイミダゾール化合物、および溶媒を含有することを特徴とするポリイミド前駆体組成物。【選択図】なし