COMPOUND, MOLDED BODY AND CURED PRODUCT OF COMPOUND

To provide a compound capable of forming a molded body excellent in reflow resistance, to provide a molded body using the same and to provide a cured product of a compound.SOLUTION: A compound according to one aspect of the present invention comprises metal powder and a resin composition containing...

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Bibliographische Detailangaben
Hauptverfasser:	KOSAKA MASAHIKO, YAMAGUCHI SHOHEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a compound capable of forming a molded body excellent in reflow resistance, to provide a molded body using the same and to provide a cured product of a compound.SOLUTION: A compound according to one aspect of the present invention comprises metal powder and a resin composition containing an epoxy resin, a curing agent and a plasticizer in which the plasticizer includes a polyvinyl butyral resin.SELECTED DRAWING: None 【課題】耐リフロー性に優れる成形体を形成することができるコンパウンド、それを用いた成形体、及びコンパウンドの硬化物を提供すること。【解決手段】本発明の一側面に係るコンパウンドは、金属粉と、エポキシ樹脂、硬化剤及び可塑剤を含有する樹脂組成物と、を備え、上記可塑剤が、ポリビニルブチラール樹脂を含む。【選択図】なし