DIRECTIONAL COUPLER, DEVICE FOR PROCESSING SUBSTRATE, AND METHOD FOR PROCESSING SUBSTRATE

To provide a technique for obtaining good directional characteristics while loosely coupling a coupling line which is a sub line to a central conductor which is a main line of a directional coupler.SOLUTION: In a directional coupler, a hollow coaxial line includes a central conductor that forms a main line, and an outer conductor that is provided so as to surround the center conductor and having an opening. The dielectric substrate is provided so as to cover the opening, and covers each of the back surface side facing the central conductor and the front surface side opposite to the back surface side through the opening, and is provided with a grounded film-like ground conductor. A coupling line is a sub line provided in a region surrounded by the ground conductor on the back surface side. Further, a conductor deletion portion in which a part of a conductor film in a region facing the coupling line is deleted via the dielectric substrate is provided on the surface side of the ground conductor.SELECTED DRAWING: Figure 8 【課題】方向性結合器の主線路である中心導体に対して、副線路である結合線路を疎結合させつつ、良好な方向性特性を得る技術を提供する。【解決手段】方向性結合器において、中空同軸線路は、主線路を成す中心導体と、中心導体の周囲を囲むように設けられ、開口部が形成された外部導体と、を備え、誘電体基板は、開口部を覆うように設けられ、前記開口部を介して前記中心導体に対向する裏面側と、前記裏面側とは反対の表面側との各々を覆い、接地された膜状の接地導体が設けられる。結合線路は、前記裏面側の前記接地導体に囲まれた領域内に設けられた副線路である。さらに表面側の前記接地導体には、前記誘電体基板を介して前記結合線路と相対する領域内の導体膜の一部を削除した導体削除部が設けられている。【選択図】図８