CUTTING DEVICE AND CUTTING METHOD

To make it possible to suppress deterioration in a detection state of a work-piece imaged over a transparent part.SOLUTION: A cutting device 1 comprises: a holding table 12 which has a transparent part 123 composed of a transparent member on at least a part of a holding surface 124, and holds a work...

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Bibliographische Detailangaben
Hauptverfasser: HANASHIMA SATOSHI, NAKAMA JUN
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To make it possible to suppress deterioration in a detection state of a work-piece imaged over a transparent part.SOLUTION: A cutting device 1 comprises: a holding table 12 which has a transparent part 123 composed of a transparent member on at least a part of a holding surface 124, and holds a work-piece 200; a cutting unit 20 having a cutting blade 21 for cutting the work-piece 200 held by the holding table 12 and a cutting water nozzle 24 for supplying cutting water during cutting of the work-piece 200 by the cutting blade 21; an imaging camera which images the work-piece 200 via the transparent part 123; and a removal unit 60 for removing liquid adhering to the transparent part 123. The removal unit 60 has a contact member which is positioned at a contact position in contact with the transparent part 123 and at a retreat position, and an X-axis movement unit which relatively moves the contact member in contact with the transparent part 123 on the transparent part.SELECTED DRAWING: Figure 1 【課題】透明部越しに撮像した被加工物の検出状態の悪化を抑制することができること。【解決手段】切削装置1は、少なくとも保持面124の一部に透明部材からなる透明部123を有し被加工物200を保持する保持テーブル12と、保持テーブル12で保持された被加工物200を切削する切削ブレード21と、切削ブレード21による被加工物200の切削中に切削水を供給する切削水ノズル24と、を有した切削ユニット20と、透明部123を介して被加工物200を撮像する撮像カメラと、透明部123に付着した液体を除去する除去ユニット60と、を備える。除去ユニット60は、透明部123に当接する当接位置と退避位置とに位置付けられる当接部材と、透明部に当接した当接部材を透明部123上で相対移動させるX軸移動ユニットとを有する。【選択図】図1