MEMS DEVICE

To provide a MEMS device satisfactory in operation and excellent in connection reliability.SOLUTION: A MEMS device comprises: a wiring board 200; and a MEMS element 100 including a square frame-shaped support portion 110 having a first surface and a second surface opposite the first surface and an e...

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1. Verfasser: YOSHIKAWA MASAMI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a MEMS device satisfactory in operation and excellent in connection reliability.SOLUTION: A MEMS device comprises: a wiring board 200; and a MEMS element 100 including a square frame-shaped support portion 110 having a first surface and a second surface opposite the first surface and an element portion 120 located on the first surface of the support portion 110; wherein the element portion 120 has: a frame portion 122 overlapping the support portion 110; and a functional portion 121 located inside the frame portion 122 and connected to the frame portion 122; wherein the second surface of the support portion 110 and the wiring board 200 are joined by a plurality of joining members 300 arranged spaced apart from each other at four respective side portions of the support portion 110; and wherein, of the four side portions of the support portion 110, an interval between the joining members 300 at a first side portion 113 is smaller than an interval between the joining members 300 at a second side portion 114.SELECTED DRAWING: Figure 1 【課題】動作が良好で接続信頼性に優れたMEMS装置を提供すること。【解決手段】配線基板200と、第1面および第1面の反対側の第2面を有する四角枠状の支持部110ならびに該支持部110の前記第1面上に位置する素子部120とを備えるMEMS素子100と、を含み、前記素子部120は、前記支持部110と重なる枠部122および該枠部122の内側に位置して前記枠部122に接続されている機能部121を有し、前記支持部110の前記第2面と前記配線基板200とが、前記支持部110の4つの辺部のそれぞれにおいて互いに間隔を設けて配置された複数の接合部材300で接合されており、前記支持部110の4つの辺部のうち、第1辺部113における接合部材300の間隔は、第2辺部114における接合部材300の間隔よりも小さいMEMS装置。【選択図】図1