SPUTTERING TARGET

To provide a sputtering target which allows suppression of contamination of a fluorine element being an impurity in the sputtering target, suppression of generation of an abnormal discharge due to fluorine when a thin film is formed by using the sputtering target, and formation of a thin film having...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI TAKESHI, OTOMO SHOHEI, NAKAMURA HIRONOBU, MARUKO TOSHIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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