CURABLE RESIN COMPOSITION, DRY FILM, COPPER FOIL WITH RESIN, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide a curable resin composition that gives a cured product having high heat resistance and low dielectric loss tangent.SOLUTION: A curable resin composition contains (A) an epoxy resin, (B) a compound having an active ester group, and (C) an inorganic filler, the (A) epoxy compound containing...

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Bibliographische Detailangaben
Hauptverfasser:	HIROTA YOSUKE, AOYAMA YOSHITOMO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a curable resin composition that gives a cured product having high heat resistance and low dielectric loss tangent.SOLUTION: A curable resin composition contains (A) an epoxy resin, (B) a compound having an active ester group, and (C) an inorganic filler, the (A) epoxy compound containing (A-1) an epoxy compound represented by the formula (I) (where at least one of R1-R15 is a glycidyloxy group).SELECTED DRAWING: None 【課題】高い耐熱性、および低誘電正接を備えた硬化物が得られる硬化性樹脂組成物の提供。【解決手段】（Ａ）エポキシ化合物、（Ｂ）活性エステル基を有する化合物、および（Ｃ）無機フィラーを含有し、（Ａ）エポキシ化合物が、下記式（Ｉ）（ただし、Ｒ１〜Ｒ１５の少なくとも１個がグリシジルオキシ基である）で表される（Ａ−１）エポキシ化合物を含有する硬化性樹脂組成物。【選択図】なし