CURABLE RESIN COMPOSITION, DRY FILM, COPPER FOIL WITH RESIN, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide a curable resin composition that gives a cured product having high heat resistance, low dielectric constant, low dielectric loss tangent, and excellent adhesion to a conductor metal, a dry film having a resin layer obtained from the composition, a copper foil with resin, a cured product,...

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Bibliographische Detailangaben
Hauptverfasser:	HIROTA YOSUKE, AOYAMA YOSHITOMO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a curable resin composition that gives a cured product having high heat resistance, low dielectric constant, low dielectric loss tangent, and excellent adhesion to a conductor metal, a dry film having a resin layer obtained from the composition, a copper foil with resin, a cured product, and an electronic component.SOLUTION: A curable resin composition contains (A) an epoxy resin, (B) a compound having an active ester group, (C) an inorganic filler and (D) a polyester additive, the (D) polyester additive being a polymer having a polyalkylene glycol structure and an aliphatic polyester structure. There are also provided a dry film, a copper foil with resin, a cured product, and an electronic component each of which contains the curable resin composition.SELECTED DRAWING: None 【課題】高い耐熱性、低誘電率、低誘電正接、および導体金属に対する優れた密着性を備えた硬化物が得られる硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、樹脂付き銅箔、硬化物、および電子部品を得る。【解決手段】（Ａ）エポキシ樹脂、（Ｂ）活性エステル基を有する化合物、（Ｃ）無機フィラーおよび（Ｄ）ポリエステル添加剤を含み、（Ｄ）ポリエステル添加剤が、ポリアルキレングリコール構造と脂肪族ポリエステル構造を有する重合体であることを特徴とする硬化性樹脂組成物、これを含むドライフィルム、樹脂付き銅箔、硬化物、および電子部品が得られた。【選択図】なし