FILM DEPOSITION DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

To provide a film deposition device that prevents a deterioration in the mask adsorption power of magnetic force application means, and a method for producing an electronic device.SOLUTION: A film deposition device has an electrostatic chuck having a substrate holding face that holds a substrate, a...

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Hauptverfasser: AONUMA DAISUKE, SUGAWARA HIROKI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a film deposition device that prevents a deterioration in the mask adsorption power of magnetic force application means, and a method for producing an electronic device.SOLUTION: A film deposition device has an electrostatic chuck having a substrate holding face that holds a substrate, a mask support unit that is installed on the substrate holding face side and holds a mask, magnetic force application means that is installed on the opposite side of the substrate holding face with respect to the electrostatic chuck and applies magnetic force to the mask, and cooling means that is installed on the opposite side of the substrate holding face with respect to the electrostatic chuck and cools the substrate. The film deposition device deposits a vapor deposition material on the substrate through the mask. In a cross direction crossing the substrate holding face, the magnetic force application means and the cooling means are arranged in an overlapping manner.SELECTED DRAWING: Figure 3 【課題】磁力印加手段によるマスクの吸着力が低下することを抑制できる成膜装置及び電子デバイスの製造方法を提供する。【解決手段】基板を保持する基板保持面を有する静電チャックと、前記基板保持面側に設置され、マスクを保持するためのマスク支持ユニットと、前記静電チャックに対して前記基板保持面の反対側に設置され、マスクに磁力を印加するための磁力印加手段と、前記静電チャックに対して前記基板保持面の反対側に設置され、基板を冷却するための冷却手段と、を備え、マスクを介して基板に蒸着材料を成膜する成膜装置において、前記基板保持面と交差する交差方向において、前記磁力印加手段と前記冷却手段は重複して配置されることを特徴とする。【選択図】図3