POLISHING COMPOSITION

To provide a polishing composition capable of reducing vibration of a device when polishing using a glass epoxy resin carrier.SOLUTION: A polishing composition includes abrasive grains, load inhibitors, water soluble polymers, basic compounds, and water. A contact angle A of 0.1 mass% aqueous soluti...

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Bibliographische Detailangaben
1. Verfasser:	YAMAZAKI TOMOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing composition capable of reducing vibration of a device when polishing using a glass epoxy resin carrier.SOLUTION: A polishing composition includes abrasive grains, load inhibitors, water soluble polymers, basic compounds, and water. A contact angle A of 0.1 mass% aqueous solution of the load inhibitor with respect to the surface of the glass epoxy resin plate having the surface roughness Ra=3.0 nm, the surface tension B of 0.1 mass% aqueous solution of the load inhibitor, and the molecular weight C of the load inhibitor satisfy the following formula. A×B/C