FILM FORMATION DEVICE

To provide a board holding device that can shift from a holding state to a released state without sticking the board to a pressing tool.SOLUTION: A board holding device includes a support 2 that supports a substrate 1, and a pressing tool 3 that is arranged to face the supporting tool 2 and presses...

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Bibliographische Detailangaben
1. Verfasser:	SHIOIRI NOBURO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a board holding device that can shift from a holding state to a released state without sticking the board to a pressing tool.SOLUTION: A board holding device includes a support 2 that supports a substrate 1, and a pressing tool 3 that is arranged to face the supporting tool 2 and presses the substrate 1, and holds the substrate 1 between the support 2 and the pressing tool 3, and the pressing tool 3 is provided with a large pressing portion 4 and a small pressing portion 5 having a smaller contact area with the substrate 1 than the large pressing portion 4, and the large pressing portion 4 is provided with a small pressing portion urging mechanism that urges the small pressing portion 5 against the substrate 1 side.SELECTED DRAWING: Figure 1 【課題】基板を押圧具に貼り付かせることなく、挟持状態から解放状態に移行できる基板挟持装置の提供。【解決手段】基板１を支持する支持具２と、この支持具２に対向配置され、前記基板１を押圧する押圧具３とを有し、前記支持具２と前記押圧具３とで前記基板１を挟持する基板挟持装置であって、前記押圧具３には、大押圧部４と、この大押圧部４より基板１との接触面積が小さい小押圧部５とを設け、前記大押圧部４には、前記小押圧部５を前記基板１側に付勢する小押圧部付勢機構を備える。【選択図】図１